Copper Zipper Fin Vapor Chamber 1u Server Heat Sink for LGA4189 CPU

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Copper Zipper Fin Vapor Chamber 1u Server Heat Sink for LGA4189 CPU

Copper Zipper Fin Vapor Chamber 1u Server Heat Sink for LGA4189 CPU

LGA4189 CPU heat sink is designed for Intel LGA4189 socket, this CPU heat sink cooler consists of copper stamped zipper

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DESCRIPTION

Basic Info.
Model NO. S72
Surface Finish Nickel Plating, Passivation
Manufacturing Process Stamping, CNC, Soldering
Transport Package Tray, Carton
Specification customized
Trademark Sinda Thermal
Origin China
HS Code 7403111100
Production Capacity 50000/Month
Product Description

LGA4189 CPU heat sink is designed for Intel LGA4189 socket, this CPU heat sink cooler consists of copper stamped zipper fin, copper vapor chamber. Stamped zipper fin stack is a critical component due to it has great heat dissipation performance. A stamped zipper fin stack is manufactured by using a stamping process to punch the copper sheets into designed shape from a tooling die. The fin stack are manufactured to create interlocking fins by stamping process, the copper zipper fin can be manufactured with a range of geometrics and thickness. The stamping fin technique provides high production efficiency, high aspect ratio, lightweight, and good thermal performance. Also it offers low Non recurring engineering charge, so the prototype cost can be minimal.vapor chamber is a very high effective thermal device, it's a two phase thermal component which transport the heat from the heat source to the copper fins rapidly to avoid the electronic components overheating. This heatsink is designed for high power electronic devices such as CPU, IGBT, Inverter,etc. Sinda Thermal offers varieties of CPU heat sink and coolers for many Intel and AMD CPU types such as LGA4677, LGA4189, LGA4677,LGA1700,LGA1200/115X, LGA3647,AMD SP3, AMD SP5,etc.
Product specifications
MaterialCopper CertificatesISO 9001:2015,ISO 14001:2015
Product dimension113mm*78mm*25mmTypeSoldering heat sink
ProcessStamping, CNC, solderingLead time4 weeks
Surface finishPassivation, nickel platingPackingTray, carton
OEM/ODMYesQuality control100%
ApplicationLGA4189 CPUWarrantly1 year

Varieties of heat sink
Thermal simulation
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Copper Zipper Fin Vapor Chamber 1u Server Heat Sink for LGA4189 CPU


Copper Zipper Fin Vapor Chamber 1u Server Heat Sink for LGA4189 CPU


Sinda Thermal is a leading thermal manufacturer in China, our factory was founded in 2014, and located in Dongguan city, China, we are offering varieties of heatsinks and other precious metal parts. Our plant possesses 30 sets advanced and high precious CNC machines and stamping machines, also we have many testing and experiment instruments and professional engineering team, so our company can manufacture and provide high quality products with high precision and excellent thermal performance. Sinda Thermal is commited to a range of heat sinks which are widely used in new power supply, New energy vehicles, Telecommunications, Servers, IGBT, and Madical. All the products accord with Rohs/Reach standard, and the factory is qualified by ISO9001 and ISO14001. Our company has been a partner with many customers for good quality, excellent service and competitive price. Sinda Thermal is a great heat sink manufacturer for the global customers .
FAQ
1. Q: Are you a trading company or manufacturer?
A: We are a leading heat sink manufacturer, our factory has been founded over 8 years, we are professional and experienced.
2. Q: Can you provide OEM/ODM service?
A: Yes, OEM/ODM are available.
3. Q: Do you have MOQ limit?
A: No, we don't set up MOQ, prototype samples are available.
4. Q: What's the lead time of the production?
A: For prototype samples, the lead time is 1-2 weeks, for mass production, the lead time is 4-6 weeks.
5. Q: Can I visit your factory?
A: Yes, Welcome to Sinda Thermal.