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Basic Info.

Noise Level	Low
Application Fields	Electronics
Certification	ISO
Condition	New
Transport Package	Carton
Specification	305*305*0.16mm
Trademark	NA
Origin	China
Production Capacity	500000

Product Description

Product name: Customized high thermal conductive cpu gpu copper vapor chamber
Product Description

Product Name	Vapor Chamber for electronic device
Material	T2 Copper
Function	Heat dissipation

Vapor Chamber.

Vapor Chamber technology is similar to heat pipes in principle, but differs in the way it conducts heat. The heat pipe is a one-dimensional linear heat transfer, while the heat in the Vapor Chamber is transferred on a two-dimensional surface, making it more efficient.

The super conducting thermal homogenization plate is mainly composed of bottom plate (evaporation zone), upper cover (condensation zone), capillary structure of bottom plate and upper cover (providing capillary force of liquid reflux), copper column copper ring between bottom plate and upper cover (providing liquid reflux from condensation zone to evaporation zone) and a small amount of working liquid. Vapor chamber is mainly composed of condensing zone, evaporation section, internal capillary structure, copper column, copper ring and working fluid body.Working Principle

Vapor Chamber working principlesVapor Chamber is similar to heat pipes in principle, but differs in the way it conducts heat. The heat pipe is a one-dimensional linear heat conduction, while the heat in the Vapor Chamber is conducted on a two-dimensional surface, making it more efficient. Specifically, the liquid inside of the vacuum cavity, after absorbing heat from the chip, evaporates and diffuses into the vacuum cavity, conducts heat to the heat sink , and subsequently condenses into liquid back at the bottom. This evaporation and condensation process, similar to that of a refrigerator and air conditioner, circulates rapidly within the vacuum cavity, achieving a fairly high heat dissipation efficiency.Products ApplicationThe base of the vapor chamber is heated, and the liquid insided vapor chamber is heated to evaporate rapidly as hot air in the ultra-low-pressure environment, and the hot air is heated to rise and dissipate heat after condensing area, and condense into liquid again.The liquid after condensation flows back into the evaporation source at the bottom of the vapor chamber through the capillary structure, and so on repeatedly.

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