Customized Ultra Thin Liquid Cooling Copper Vapor Chamber

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Customized Ultra Thin Liquid Cooling Copper Vapor Chamber

Customized Ultra Thin Liquid Cooling Copper Vapor Chamber

Product name: Customized ultra thin liquid cooling copper vapor chamber Product Description Vapor Chamber. Vapor Chamber

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DESCRIPTION

Basic Info.
Noise Level Low
Application Fields Electronics
Certification ISO
Condition New
Transport Package Carton
Specification 305*305*0.16mm
Trademark NA
Origin China
Production Capacity 500000
Product Description

Product name: Customized ultra thin liquid cooling copper vapor chamber
Product Description

Product NameVapor Chamber for electronic device
MaterialT2 Copper
FunctionHeat dissipation

Vapor Chamber.

Vapor Chamber technology is similar to heat pipes in principle, but differs in the way it conducts heat. The heat pipe is a one-dimensional linear heat transfer, while the heat in the Vapor Chamber is transferred on a two-dimensional surface, making it more efficient.

Customized Ultra Thin Liquid Cooling Copper Vapor Chamber

The super conducting thermal homogenization plate is mainly composed of bottom plate (evaporation zone), upper cover (condensation zone), capillary structure of bottom plate and upper cover (providing capillary force of liquid reflux), copper column copper ring between bottom plate and upper cover (providing liquid reflux from condensation zone to evaporation zone) and a small amount of working liquid. Vapor chamber is mainly composed of condensing zone, evaporation section, internal capillary structure, copper column, copper ring and working fluid body.Working Principle

Customized Ultra Thin Liquid Cooling Copper Vapor Chamber

Vapor Chamber working principlesVapor Chamber is similar to heat pipes in principle, but differs in the way it conducts heat. The heat pipe is a one-dimensional linear heat conduction, while the heat in the Vapor Chamber is conducted on a two-dimensional surface, making it more efficient. Specifically, the liquid inside of the vacuum cavity, after absorbing heat from the chip, evaporates and diffuses into the vacuum cavity, conducts heat to the heat sink , and subsequently condenses into liquid back at the bottom. This evaporation and condensation process, similar to that of a refrigerator and air conditioner, circulates rapidly within the vacuum cavity, achieving a fairly high heat dissipation efficiency.Products ApplicationThe base of the vapor chamber is heated, and the liquid insided vapor chamber is heated to evaporate rapidly as hot air in the ultra-low-pressure environment, and the hot air is heated to rise and dissipate heat after condensing area, and condense into liquid again.The liquid after condensation flows back into the evaporation source at the bottom of the vapor chamber through the capillary structure, and so on repeatedly.

Customized Ultra Thin Liquid Cooling Copper Vapor Chamber


Customized Ultra Thin Liquid Cooling Copper Vapor Chamber


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Customized Ultra Thin Liquid Cooling Copper Vapor Chamber